Description
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Sn99.3Cu0.7 no-clean solder paste is a no-clean solder paste designed for today's SMT processes. Refined with special solder paste and spherical tin powder with very low oxide content. Excellent continuous printing resolution: In addition, the solder paste contained in this product uses a low-reliability activator system with high reliability, so that it has very little residue after reflow and has high insulation Impedance, even with no-wash, can have extremely high reliability. In addition, Sn99.3Cu0.7 series no-clean solder paste can provide different alloy composition, different tin powder particle size and different metal content to meet customers' different product and process requirements.
二、Product Features
1.Good printing rollability and tin-dropping performance, and it can also finish exquisite printing on pads as low as 0.3mm (T6);
2.When continuous printing, its viscosity changes are very small, the operable life of the steel screen is long, it will not dry out after 8 hours, and still maintain good printing effect;
3.The original shape is maintained for several hours after printing, and there is almost no slump, and the patch components will not be offset;
4.It has excellent welding performance and can show proper wettability in different parts;
5.It can meet the requirements of different grades of welding equipment, and it is not necessary to complete the welding in a nitrogen-filled environment, and it can still perform well in a wide range of reflow furnace temperature;
6. Few residues after soldering, light color and large insulation resistance, will not corrode the PCB, and can meet the requirements of no-clean;
7. It has better ICT test performance without misjudgment;
8. Can be used in through-hole roller coating (Paste in hole) process.
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Lead free solder series
C9307 Lead-free solder paste
